
ITEM | Pitch | Commodity & Des | ||||||
Dimensions(mm) | Effective figures | Premium Grade Chip | ||||||
Yieid(%) | Effective figures | Optical Specifications | ||||||
1×2 Channel | Full(250um) | W(±0.2) | 1.80 | 800 | 90% | 720 | I.L | 3.5dB |
1×4 Channel | Full(250um) | W(±0.2) | 2.30 | 580 | 90% | 522 | I.L | 6.7dB |
1×8 Channel | Full(250um) | W(±0.2) | 2.30 | 450 | 90% | 405 | I.L | 9.8dB |
1×8 Channel | Half(127um) | W(±0.2) | 2.30 | 570 | 90% | 513 | I.L | 9.8dB |
1×16 Channel | Half(127um) | W(±0.2) | 2.60 | 330 | 85% | 280 | I.L | 13.0dB |
1×32 Channel | Half(127um) | W(±0.2) | 4.50 | 150 | 80% | 120 | I.L | 16.2dB |
1×64 Channel | Half(127um) | W(±0.2) | 9.30 | 49 | 75% | 37 | I.L | 19.5dB |
2×16 Channel PLC Splitter Wafer | Half(127um) | W(±0.2) | 2.60 | 230 | 75% | 172 | I.L | 13.5dB |
2×32 Channel PLC Splitter Wafer | Half(127um) | W(±0.2) | 4.50 | 110 | 75% | 82 | I.L | 17.0dB |
设备
全系列采用日韩进口设备
1xn PLC Splitter Chip
Specifications:
2xn PLC Splitter Chip
Specifications:
PLC Splitter Chip光学特性
Specifications:
芯片PCT测试
芯片PCT(Pressure Cooker Test)测试,采用业界最严谨的测试条件,
确保芯片胶合制程之稳定性,条件如下:
湿度:100%
温度:120℃
压力:0.11MPa
时间:99个小时
Oven:100℃ 60分钟
前处理:无
UV硬化:10分钟
Epoxy量:0.7g
无水分穿透现象